CMP (Chemical Mechanical Planarization or Polishing) is used in all semiconductor processes: making the insulation films different even due to element wiring or separating the element wiring by distributing the slurry containing hundreds of nm size polishing abrasives on the polishing pad surface. This induces the film's chemical reactions, and mechanically removing the transformed film surface by rotating the wafer-supporting polishing carrier and the polishing plate with the polishing pad attached at a high speed, when the wafer is stuck to the polishing pad with poly-urethane.