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YCCHEM

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LED

This polymer material enables a response to a specific wavelength's light and specific patterns to be copied. It is also used in the exposure (lithography) process among the TFT-LCD circuit element processes.

PSS Wafer Foundry Service

To improve the optical efficiency of the light-emitting diode, the surface of the sapphire wafer is plasma-etched to form a micro-pattern with a pointed (tapered) top shape.

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YPS-3000

It is a material used to remove impurities that remain after the etching process.

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YPS-1000

It is a material used to remove impurities that remain after the etching process.

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DV-2379

It is a material used in the development process, which is the final step of the photolithography process. It selectively removes the exposed and unexposed areas to form patterns on the circuit.

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YNP-4000L

The working mechanism of a photoresist composition is that, during the exposure process, the photoacid generator produces acid upon receiving light, and this acid induces an acid-catalyzed reaction in the photoresist resin. When a negative photoresist is used, a cross-linking reaction occurs, and through this reaction, the exposed and unexposed areas acquire different solubilities in the developer, allowing the formation of the desired pattern.

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YPP-S10K

The working mechanism of a photoresist composition is that, during the exposure process, the photoacid generator generates acid upon receiving light, and this acid triggers an acid-catalyzed reaction in the photoresist resin. In a positive photoresist composition, a deprotection reaction occurs, and through this reaction, the exposed and unexposed areas develop different solubilities in the developer, enabling the formation of the pattern.

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YPP-3002

“The working mechanism of a photoresist composition is that, during the exposure process, the photoacid generator produces acid upon receiving light, and this acid induces an acid-catalyzed reaction in the photoresist resin. In a positive photoresist composition, a deprotection reaction occurs, and through this reaction, the exposed and unexposed areas acquire different solubilities in the developer, thereby forming the desired pattern.

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HEAD OFFICE, 1st, 2nd, 3rd Factory

174-12, Yuseori-gil, Seonnam-myeon, Seongju-gun, Gyeongsangbuk-do, South Korea. T. +82-54-930-2500 F. +82-54-931-8521

2nd R&D Center(Siheung)

50, Eungyenam-gil, Siheung-si, Gyeonggi-do, Korea T. +82-31-702-3941

4th Factory, SEONGJU GENERAL INDUSTRIAL COMPLEX

49, Seongjusaneopdanji-ro, Seongju-eup, Seongju-gun, Gyeongsangbuk-do, South Korea. T. +82-54-930-2800 F. +82-54-930-2811

Liaison Office(New Jersey U.S.A.)

460 Bergen Blvd. Suite 262. Palisades Park, New Jersey 07650, USA T. +1-201-944-0107

5th Factory, SEONGJU GENERAL INDUSTRIAL COMPLEX

144, Seongjusaneopdanji-ro 2gil, Seongju-eup, Seongju-gun, Gyeongsangbuk-do, South Korea.

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YCCHEM

LED

PSS Wafer Foundry Service

YPS-3000

YPS-1000

DV-2379

YNP-4000L

YPP-S10K

YPP-3002

HEAD OFFICE, 1st, 2nd, 3rd Factory

2nd R&D Center(Siheung)

4th Factory, SEONGJU GENERAL INDUSTRIAL COMPLEX

Liaison Office(New Jersey U.S.A.)

5th Factory, SEONGJU GENERAL INDUSTRIAL COMPLEX