Wafering is a process of making silicon crystal into wafer. The process is generally performed by a multi-wire saw, which cuts multiple wafers concurrently of the same crystal. Eventually, the wafer is polished to the desired evenness and thickness
YSO-800 is an oil-based cutting fluid used in wafer cutting, ensuring excellent cooling, lubricity, extreme pressure, and rust resistance functions. It also has excellent effect on maintaining appropriate viscosity and compressive sedimentation prevention of SiC slurry.
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