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Wafering

Wafering is a process of making silicon crystal into wafer. The process is generally performed by a multi-wire saw, which cuts multiple wafers concurrently of the same crystal. Eventually, the wafer is polished to the desired evenness and thickness
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YSO-800

YSO-800 is an oil-based cutting fluid used in wafer cutting, ensuring excellent cooling, lubricity, extreme pressure, and rust resistance functions. It also has excellent effect on maintaining appropriate viscosity and compressive sedimentation prevention of SiC slurry.

HEAD OFFICE, 1st, 2nd, 3rd Factory

174-12, Yuseori-gil, Seonnam-myeon, Seongju-gun, Gyeongsangbuk-do, South Korea. T. +82-54-930-2500 F. +82-54-931-8521

2nd R&D Center(Siheung)

50, Eungyenam-gil, Siheung-si, Gyeonggi-do, Korea T. +82-31-702-3941

4th Factory, SEONGJU GENERAL INDUSTRIAL COMPLEX

49, Seongjusaneopdanji-ro, Seongju-eup, Seongju-gun, Gyeongsangbuk-do, South Korea. T. +82-54-930-2800 F. +82-54-930-2811

Liaison Office(New Jersey U.S.A.)

460 Bergen Blvd. Suite 262. Palisades Park, New Jersey 07650, USA T. +1-201-944-0107

5th Factory, SEONGJU GENERAL INDUSTRIAL COMPLEX

144, Seongjusaneopdanji-ro 2gil, Seongju-eup, Seongju-gun, Gyeongsangbuk-do, South Korea.

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