We have developed and commercialized photoresists for various packaging processes including the latest technology. The photoresists for packaging processes can be used for extensive production technologies such as wafer level RDL and TSV.
-Target : Thickness 6.0um (Res. 5.0um, Contact Hole)-Purpose of use : KrF Positive TSV Devices
(Positive PR TSV)-Target : Thickness 6.0um (Res. 6.0um, Contact Hole)-Purpose of use : i-Line Positive TSV Devices
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