We supply positive and negative tone photoresists designed to meet the narrow pitch of related products, such as the recently developed wafer level packaging, MEMs, and 3D photolithography. The photoresist is compatible with various metals' plated chemicals including copper, pure tin, and nickel.
(Positive type Bump Photoresist)-Target : Thickness 6.0um (Res. 5um, L/S 1:1)-Purpose of use : Positive Bump Photoresist
(Negative type Bump Photoresist)-Target : Thickness 50um (Res. 75um, Contact Hole)-Purpose of use : Negative Bump Photoresist
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