PLECT-100 / PLECT-200

-Target : Prevent collapse & Improvement of LER
-Purpose of use : ArF photoresist

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ATL-1008

-Target : Prevent collapse & Improvement of LER
-Purpose of use : KrF photoresist

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DY-200

Using the SOD and TSA to accelerate the transition to oxide

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CL-Y200

Polysilicone etchant for Quartz tube

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YSG-402E

SiGe etchant

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DE-Y250L

TMAH type developer for color filter resist

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DV-7000D / DE-Y2200 / DV-400 / DV-400S

TMAH type developer

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YCTA-9047

​-Environmentally safe; PFOS/PFOA issue free
-Low refractive index
-pH controllable

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YA-800

(Bottom Anti Refective Coating Materials)
-Target : Thickness 0.08um
-Purpose of use : ArF BARC

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YA-600A

(Bottom Anti Refective Coating Materials)
-Target : Thickness 0.06um
-Purpose of use : Gapfill BARC

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YA-400

(Bottom Anti Refective Coating Materials)
-Target : Thickness 0.04um
-Purpose of use : ArF BARC

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YCB-240

(Bottom Anti Refective Coating Materials)
-Target : Thickness 0.024um
-Purpose of use : TSV package BARC – Ball grid array bumping process

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YPP-T6K

(Positive PR TSV)
-Target : Thickness 6.0um (Res. 6.0um, Contact Hole)
-Purpose of use : i-Line Positive TSV Devices

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YCKN-2954

(Negative PR for 248nm process)
-Target : Thickness 0.54um (Res. 180nm, 250nm)
-Purpose of use : Implant & Etch Layer

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YCKN-4530

(Negative PR for 248nm process)
-Target : Thickness 0.30um (Res. 180nm)
-Purpose of use : Implant Layer

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YCKP-1654

(Positive PR for 248nm process)
-Target : Thickness 0.54um (Res. 180nm, 250nm)
-Purpose of use : Implant & Etch Layer

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YKP-503

(Positive PR for 248nm process)
-Target : Thickness 0.54um (Res. 180nm, 250nm)
-Purpose of use : Implant & Etch Layer

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YBNP-S500

(Negative type Bump Photoresist)
-Target : Thickness 50um (Res. 75um, Contact Hole)
-Purpose of use : Negative Bump Photoresist

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YCIP-1100

(Positive PR for 365nm process)
-Target : Thickness 1.1um (Res. 500nm, 1:1)
-Purpose of use : Implant & Etch Layer / OLED Devices

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YCIP-1300

(Positive PR for 365nm process)
-Target : Thickness 1.3um (Res. 500nm, 1:1)
-Purpose of use : Implant & Etch Layer / OLED Devices

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YCIP-1700

(Positive PR for 365nm process)
-Target : Thickness 1.7um (Res. 500nm, 1:1)
-Purpose of use : Implant & Etch Layer / OLED Devices

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YCIP-3630

(Positive PR for 365nm process)

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YCIP-4000E

(Positive PR for 365nm process)
-Target : Thickness 3.5um (Res. 1.5um & 3.0um, 1:1)
-Purpose of use : Implant & Metal Layer

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AYCKP-7930

  (Positive PR for 248nm process)

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