本公司针对365nm波长,制造胶片厚度为0.1um至6.0um的工程适用i-线光致抗蚀剂产品。i-线光致抗蚀剂产品系列中,正型光致抗蚀剂与负型光致抗蚀剂均可生产。若您为开发项目,正寻找i-线光致抗蚀剂解决方案,可联系本公司,我们将提供有关产品系列的更加具体的数据。
(Negative PR for 365nm process)-Target : Thickness 0.1um (Res. 1.0um, 1:1)-Purpose of use : Passivation Photoresist
(Negative PR for 365nm process)-Target : Thickness 0.17um (Res. 500um, 1:1)-Purpose of use : Passivation Photoresist
(Negative PR for 365nm process)-Target : Thickness 6.0um (Res. 500nm, 1:1)-Purpose of use : Implant Layer
(Negative PR for 365nm process)-Target : Thickness 1.0um (Res. 500nm, 1:1)-Purpose of use : Implant & Etch Layer / OLED Devices
(Negative PR for 365nm process)-Target : Thickness 2.0um ~ 6.0um (Bulk Pattern)-Purpose of use : Implant & Etch Layer / OLED Devices
(Positive PR for 365nm process)-Target : Thickness 1.1um (Res. 500nm, 1:1)-Purpose of use : Implant & Etch Layer / OLED Devices
(Positive PR for 365nm process)-Target : Thickness 1.3um (Res. 500nm, 1:1)-Purpose of use : Implant & Etch Layer / OLED Devices
(Positive PR for 365nm process)-Target : Thickness 1.7um (Res. 500nm, 1:1)-Purpose of use : Implant & Etch Layer / OLED Devices
(Positive PR for 365nm process)
(Positive PR for 365nm process)-Target : Thickness 3.5um (Res. 1.5um & 3.0um, 1:1)-Purpose of use : Implant & Metal Layer
(Positive PR for 405nm process, Glass Package PR)
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