提供为满足最近发展的圆片级封装、MEMS及3D影印法等应用产品的窄齿距与各种地势而设计的正调及负调光致抗蚀剂。可与包括铜、纯锡及镍在内的各种金属的镀金化学物质互换
(Positive type Bump Photoresist)-Target : Thickness 6.0um (Res. 5um, L/S 1:1)-Purpose of use : Positive Bump Photoresist
(Negative type Bump Photoresist)-Target : Thickness 50um (Res. 75um, Contact Hole)-Purpose of use : Negative Bump Photoresist
卷轴
上移