YCLW-S804

Tunable selective polishing slurry for the tungsten/oxide layer and minimum dishing.

下载

YCIN-130

(Negative PR for 365nm process)
-Target : Thickness 0.1um (Res. 1.0um, 1:1)
-Purpose of use : Passivation Photoresist

下载

YWSO-200-series

(Wire-saw cutting fluid)

下载

YCIN-350

(Negative PR for 365nm process)
-Target : Thickness 0.17um (Res. 500um, 1:1)
-Purpose of use : Passivation Photoresist

下载

YWSP-300-series

(Wire-saw cutting fluid)

下载

YCIN-600

(Negative PR for 365nm process)
-Target : Thickness 6.0um (Res. 500nm, 1:1)
-Purpose of use : Implant Layer

下载

YDWC-200S

(Wafer cleaning solution)

下载

YCIN-1000

(Negative PR for 365nm process)
-Target : Thickness 1.0um (Res. 500nm, 1:1)
-Purpose of use : Implant & Etch Layer / OLED Devices

下载

YPWC-230K

(Wafer cleaning solution)

下载

YCIN-2000/YCIN-6000

(Negative PR for 365nm process)
-Target : Thickness 2.0um ~ 6.0um (Bulk Pattern)
-Purpose of use : Implant & Etch Layer / OLED Devices

下载

Cleaning equipment

Hybrid Spin & Wet Station for Wafer Cleaning

下载

H3PO4 concentration analyzer equipment

Monitoring System of H3PO4 concentration

下载

YPPC-200A

(Wafer cleaning solution)

下载

YW-300

CMP slurry for Tungsten buffing step

下载

YCKB-H702

Copper CMP slurry for barrier metal layer planarization

下载

YCHC-S711

Copper CMP slurry for bulk removal

下载

YSV-100

Copper CMP slurry for TSV & WLP

下载

YPS-900

Poly-Si removal slurry

下载

YWC-S03

Carbon hard mask layer removal slurry

下载

YSPS-30

YSPS-30 is Planarization

下载

YSHE-31/YSHS-20/YSHS-31/YSHE-200/YSHS-04

YSHE-31, YSHS-20, YSHS-31, YSHE-200, YSHS-04 is High etch resistance

下载

YSHS-13/YSHS-19

YSHS-13, YSHS-19 is Spin on Hot-temperature carbon hardmask.

下载

YSC-100

(Hard-mask post etch residue cleaning solution)

下载

AYCDN-4107

(Metal-oxide resist developer)

下载