본문바로가기
닫기
Company Profile
CEO's Message
Vision
History
Technology Research Center
Organization
Partner Firms and Customers
Location
Business Area
Semiconductor
Display
Eco-friendly energy
General
Product
Semiconductor
Display
Eco-friendly energy
General
IR
Notices
Disclosure
Customer Service Center
Notice
Archive
Inquiries
LANGUAGE
KO
EN
CN
Semiconductor
Display
Eco-friendly energy
General
Semiconductor
All
I-Line Photoresist
Bump Photoresist
KrF Photoresist
TSV Thick Photoresist
BARC
TARC
Developer
Etchant
Promoter
Rinsing Solution
Spin On Carbon Hardmask
CMP
Wafering
A Total of
62
hit(s)
Subject
Contents
Name
PLECT-100 / PLECT-200
-Target : Prevent collapse & Improvement of LER
-Purpose of use : ArF photoresist
ATL-1008
-Target : Prevent collapse & Improvement of LER
-Purpose of use : KrF photoresist
DY-200
Using the SOD and TSA to accelerate the transition to oxide
Promoter
This is a material used to accelerate oxidation.
YMCA-W096
Word-line(W/TiN) recess wet-etch solution.
YMCA-M128
Word-line(Mo/TiN) recess wet-etch solution.
CL-Y200
Polysilicone etchant for Quartz tube
YSG-402E
SiGe etchant
DE-Y250L
TMAH type developer for color filter resist
DV-7000D / DE-Y2200 / DV-400 / DV-400S
TMAH type developer
YCTA-9047
-Environmentally safe; PFOS/PFOA issue free
-Low refractive index
-pH controllable
YA-800
-Target : Thickness 0.08um
-Purpose of use : ArF BARC
YA-600A
-Target : Thickness 0.06um
-Purpose of use : Gapfill BARC
YA-400
-Target : Thickness 0.04um
-Purpose of use : ArF BARC
YCB-240
-Target : Thickness 0.024um
-Purpose of use : TSV package BARC – Ball grid array bumping process
1
2
3
4
5
