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I-Line Photoresist
Bump Photoresist
KrF Photoresist
TSV Thick Photoresist
BARC
TARC
Developer
Etchant
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Rinsing Solution
Spin On Carbon Hardmask
CMP
Wafering
A Total of
3
hit(s)
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Bump Photoresist
We supply positive and negative tone photoresists designed to meet the narrow pitch of related products, such as the recently developed wafer level packaging, MEMs, and 3D photolithography. The photoresist is compatible with various metals' plated chemicals including copper, pure tin, and nickel.
YBNP-S500
-Target : Thickness 50um (Res. 75um, Contact Hole)
-Purpose of use : Negative Bump Photoresist
YPP-6000
-Target : Thickness 6.0um (Res. 5um, L/S 1:1)
-Purpose of use : Positive Bump Photoresist
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